• DocumentCode
    1702744
  • Title

    Effect of shallow trench isolation induced stress on CMOS transistor mismatch

  • Author

    Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman

  • Author_Institution
    Silterra Malaysia Sdn Bhd, Kedah, Malaysia
  • fYear
    2004
  • Abstract
    Mechanical compressive stress induced by shallow trench isolation (STI) and transistor mismatch is the two important effects that we should take into account when scaling down CMOS transistors. In this paper, we study the relationship between these two effects. Our finding shows that STI induced stress effect improve NMOS Id matching but degrade PMOS Id matching. These effects become more obvious for small size transistors. The STI stress effect has no significant effect on Vt mismatch.
  • Keywords
    MOSFET; isolation technology; stress effects; CMOS transistor mismatch; NMOS Id matching; PMOS Id matching; induced stress; mechanical compressive stress; shallow trench isolation; stress effect; CMOS technology; Compressive stress; Degradation; Fingers; MOS devices; Packaging; Shape; Stress measurement; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
  • Print_ISBN
    0-7803-8658-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2004.1620867
  • Filename
    1620867