DocumentCode
1702744
Title
Effect of shallow trench isolation induced stress on CMOS transistor mismatch
Author
Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman
Author_Institution
Silterra Malaysia Sdn Bhd, Kedah, Malaysia
fYear
2004
Abstract
Mechanical compressive stress induced by shallow trench isolation (STI) and transistor mismatch is the two important effects that we should take into account when scaling down CMOS transistors. In this paper, we study the relationship between these two effects. Our finding shows that STI induced stress effect improve NMOS Id matching but degrade PMOS Id matching. These effects become more obvious for small size transistors. The STI stress effect has no significant effect on Vt mismatch.
Keywords
MOSFET; isolation technology; stress effects; CMOS transistor mismatch; NMOS Id matching; PMOS Id matching; induced stress; mechanical compressive stress; shallow trench isolation; stress effect; CMOS technology; Compressive stress; Degradation; Fingers; MOS devices; Packaging; Shape; Stress measurement; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on
Print_ISBN
0-7803-8658-2
Type
conf
DOI
10.1109/SMELEC.2004.1620867
Filename
1620867
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