• DocumentCode
    1702776
  • Title

    Microfabrication of actuators

  • Author

    Syms, R.R.A.

  • Author_Institution
    Dept. of Electron. & Electric. Eng., Imperial Coll., London, UK
  • fYear
    1993
  • fDate
    10/13/1993 12:00:00 AM
  • Firstpage
    42522
  • Lastpage
    42524
  • Abstract
    The author discusses general principles and main components of linear micromechanical actuators. The different actuators have some commonality in their construction. In each case, it is required to fabricate stiff mechanical parts from a conductor, so that voltages may be applied to generate electric fields. The parts must be spaced from the substrate to allow motion, and electrically isolated from each other and the substrate. The author presents two common methods of fabrication on Si. In the first method the substrate is n-(100)Si, which can be etched by anisotropic etchants such as EDP and KOH. Mechanical parts are defined by a heavy boron diffusion prior to etching. This method is most appropriate for piezoelectric devices. The second method is a more sophisticated multilayer process, in which a sacrificial insulator is placed between the substrate and the mechanical parts
  • Keywords
    electric actuators; micromechanical devices; piezoelectric actuators; small electric machines; EDP; KOH; Si substrate; anisotropic etchants; etching; linear micromechanical actuators; multilayer process; piezoelectric devices; semiconductor;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microengineering - the Future!, IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • Filename
    280330