DocumentCode
1702776
Title
Microfabrication of actuators
Author
Syms, R.R.A.
Author_Institution
Dept. of Electron. & Electric. Eng., Imperial Coll., London, UK
fYear
1993
fDate
10/13/1993 12:00:00 AM
Firstpage
42522
Lastpage
42524
Abstract
The author discusses general principles and main components of linear micromechanical actuators. The different actuators have some commonality in their construction. In each case, it is required to fabricate stiff mechanical parts from a conductor, so that voltages may be applied to generate electric fields. The parts must be spaced from the substrate to allow motion, and electrically isolated from each other and the substrate. The author presents two common methods of fabrication on Si. In the first method the substrate is n-(100)Si, which can be etched by anisotropic etchants such as EDP and KOH. Mechanical parts are defined by a heavy boron diffusion prior to etching. This method is most appropriate for piezoelectric devices. The second method is a more sophisticated multilayer process, in which a sacrificial insulator is placed between the substrate and the mechanical parts
Keywords
electric actuators; micromechanical devices; piezoelectric actuators; small electric machines; EDP; KOH; Si substrate; anisotropic etchants; etching; linear micromechanical actuators; multilayer process; piezoelectric devices; semiconductor;
fLanguage
English
Publisher
iet
Conference_Titel
Microengineering - the Future!, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
280330
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