DocumentCode
1702814
Title
Microengineering technologies and capabilities
Author
Rogers, Tony
Author_Institution
Appl. Microeng. Ltd., Bourne End, UK
fYear
1993
fDate
10/13/1993 12:00:00 AM
Firstpage
42491
Lastpage
42493
Abstract
The various silicon-based technologies applicable to microengineering are reviewed and their limitations with regard to 3-dimensional fabrication are discussed. The reasons for needing a 3-dimensional microengineering technique are then discussed and the current capability of existing non-silicon processes for satisfying this need are examined. A technique, selective anodisation, is then presented which enables the fabrication of true 3-dimensional microstructures and devices while maintaining the benefits of silicon processing
Keywords
anodisation; elemental semiconductors; micromechanical devices; semiconductor technology; silicon; Si processing; microengineering technique; review; selective anodisation; semiconductor; three-dimensional fabrication;
fLanguage
English
Publisher
iet
Conference_Titel
Microengineering - the Future!, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
280331
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