DocumentCode
1704487
Title
Fast 3-D impedance extraction of VLSI interconnects based on the K element
Author
Wei, Hongchuan ; Yu, Wenjian ; Yang, Liu ; Wang, Zeyi
Author_Institution
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume
2
fYear
2005
Lastpage
1205
Abstract
In integrated circuits with frequency above several GHz, the parasitic inductive effect greatly influences the circuit performance, therefore requiring an efficient algorithm for extraction of frequency-dependent inductance and resistance. Based on the good localization property of the K element (inverse of the partial inductance method), a fast algorithm for interconnect inductance and resistance extraction is proposed in this paper. With an efficient window selection technique, filament partitioning, and two improvements in calculating filament inductance and inverting the global admittance matrix, complex structures of multilayered interconnects can be handled very well. While preserving good accuracy, the presented method exhibits about 100x speed-up over the FastHenry for some actual examples.
Keywords
VLSI; electric admittance measurement; electric impedance measurement; inductance measurement; integrated circuit interconnections; matrix inversion; 3D impedance extraction; K element; VLSI interconnects; filament partitioning; frequency-dependent inductance; global admittance matrix inversion; integrated circuits; interconnect inductance; multilayered interconnects; parasitic inductive effect; resistance extraction; window selection; Circuit simulation; Conductors; Coupling circuits; Electronic design automation and methodology; Frequency; Impedance; Inductance; Integrated circuit interconnections; Partitioning algorithms; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems, 2005. Proceedings. 2005 International Conference on
Print_ISBN
0-7803-9015-6
Type
conf
DOI
10.1109/ICCCAS.2005.1495323
Filename
1495323
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