• DocumentCode
    1704487
  • Title

    Fast 3-D impedance extraction of VLSI interconnects based on the K element

  • Author

    Wei, Hongchuan ; Yu, Wenjian ; Yang, Liu ; Wang, Zeyi

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    2005
  • Lastpage
    1205
  • Abstract
    In integrated circuits with frequency above several GHz, the parasitic inductive effect greatly influences the circuit performance, therefore requiring an efficient algorithm for extraction of frequency-dependent inductance and resistance. Based on the good localization property of the K element (inverse of the partial inductance method), a fast algorithm for interconnect inductance and resistance extraction is proposed in this paper. With an efficient window selection technique, filament partitioning, and two improvements in calculating filament inductance and inverting the global admittance matrix, complex structures of multilayered interconnects can be handled very well. While preserving good accuracy, the presented method exhibits about 100x speed-up over the FastHenry for some actual examples.
  • Keywords
    VLSI; electric admittance measurement; electric impedance measurement; inductance measurement; integrated circuit interconnections; matrix inversion; 3D impedance extraction; K element; VLSI interconnects; filament partitioning; frequency-dependent inductance; global admittance matrix inversion; integrated circuits; interconnect inductance; multilayered interconnects; parasitic inductive effect; resistance extraction; window selection; Circuit simulation; Conductors; Coupling circuits; Electronic design automation and methodology; Frequency; Impedance; Inductance; Integrated circuit interconnections; Partitioning algorithms; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2005. Proceedings. 2005 International Conference on
  • Print_ISBN
    0-7803-9015-6
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2005.1495323
  • Filename
    1495323