• DocumentCode
    1706764
  • Title

    Using the time frequency structure of pitch periods to improve speaker verification systems

  • Author

    Nickel, Robert M. ; Williams, William J.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1998
  • Firstpage
    145
  • Lastpage
    148
  • Abstract
    Commonly used robust speaker verification systems are based on time-varying autoregressive spectral estimation (AR) combined with hidden Markov modeling (HMM) or dynamic time warping (DTW). An exhaustive optimization of these methods in the past has culminated in quite reliable verification schemes. It seems unlikely, though, that further significant improvements are readily obtained along the same path. Unlike time-varying AR-modeling, which focuses on the the global spectral structure of an utterance, we are introducing a new method that focuses on the local time-varying spectral structure of individual pitch periods. Additionally, a pattern classification method using singular value decomposition (SVD) is employed. The new method by itself does not deliver better results than commonly used global methods; however, it is shown that an acceptance/rejection decision derived from both global and local analysis greatly improves the performance of the verification system
  • Keywords
    pattern classification; singular value decomposition; speaker recognition; spectral analysis; time-frequency analysis; SVD; acceptance/rejection decision; local time-varying spectral structure; pattern classification method; performance; pitch periods; singular value decomposition; speaker verification systems; time frequency structure; Cepstral analysis; Hidden Markov models; Linear predictive coding; Nickel; Optimization methods; Pattern classification; Performance analysis; Robustness; Time frequency analysis; Time varying systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Time-Frequency and Time-Scale Analysis, 1998. Proceedings of the IEEE-SP International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • Print_ISBN
    0-7803-5073-1
  • Type

    conf

  • DOI
    10.1109/TFSA.1998.721382
  • Filename
    721382