• DocumentCode
    1708499
  • Title

    A 10.4pJ/b (32, 8) LDPC decoder with time-domain analog and digital mixed-signal processing

  • Author

    Miyashita, D. ; Yamaki, R. ; Hashiyoshi, K. ; Kobayashi, Hideo ; Kousai, Shouhei ; Oowaki, Yukihito ; Unekawa, Y.

  • Author_Institution
    Toshiba, Kawasaki, Japan
  • fYear
    2013
  • Firstpage
    420
  • Lastpage
    421
  • Abstract
    Analog computation is potentially more efficient in certain arithmetic operations since a single wire can represent multiple bits of information, while digital systems retain advantages, for example, in logical operations. However, the use of conventional voltage-domain analog computation [1, 2] is limited due to its poor scalability, design complexity, and the overhead of interface circuits (i.e. ADC/DAC) to a surrounding digital system. Therefore, an alternate technique is required for exploiting the efficiency of analog computation. In this paper, we propose time-domain analog and digital mixed (TDMixed) signal processing, wherein time instead of voltage is utilized as the analog signal. To verify the validity of the TDMixed signal processing, we implement an (32, 8) low-density parity-check (LDPC) decoder in 65nm CMOS. The decoder achieves power and area efficiencies of 10.4pJ/b and 6.1Gb/s/mm2, respectively.
  • Keywords
    CMOS analogue integrated circuits; arithmetic; circuit complexity; integrated circuit design; mixed analogue-digital integrated circuits; parity check codes; time-domain analysis; wires (electric); ADC/DAC; CMOS; LDPC decoder; TDMixed signal processing; arithmetic operation; design complexity; digital system; interface circuit overhead; logical operation; low-density parity-check decoder; size 65 nm; time-domain analog and digital mixed-signal processing; voltage-domain analog computation; wire; CMOS integrated circuits; Decoding; Logic gates; Parity check codes; Signal processing; Time-domain analysis; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2013 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-4515-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2013.6487796
  • Filename
    6487796