DocumentCode
1709933
Title
Extraction of a SPICE via model from full-wave modeling for differential signaling
Author
Luan, Shaofeng ; Selli, Giuseppe ; Drewniak, James L. ; De Luca, Andrea ; Antonini, Giulio ; Scogna, Ciccomancini ; Orlandi, Antonio
Author_Institution
EMC Lab., Missouri Univ., Rolla, MO, USA
Volume
2
fYear
2004
Firstpage
577
Abstract
The paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
Keywords
SPICE; circuit simulation; printed circuit design; PCB; SPICE via model; differential signaling; digital circuit system designs; full-wave modeling; high-speed digital designs; printed circuit boards; signal integrity; via transitions; Capacitance; Coupling circuits; Electromagnetic compatibility; Libraries; Passive networks; SPICE; Scattering parameters; Signal processing; Solids; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2004. EMC 2004. 2004 InternationalSymposium on
Print_ISBN
0-7803-8443-1
Type
conf
DOI
10.1109/ISEMC.2004.1349862
Filename
1349862
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