DocumentCode

1711275

Title

Creep properties of Sn-rich solder joints

Author

Morris, J.W., Jr. ; Song, H.G. ; Hua, Fay

Author_Institution

University of California

fYear

2003

Firstpage

54

Lastpage

57

Keywords

Creep; Materials science and technology; Microelectronics; Soldering; Steady-state; Temperature; Testing; Thermal expansion; Thermal stresses; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216256

Filename

1216256