• DocumentCode
    1711405
  • Title

    Error correction for finite semiconductor resistivity in Kelvin test structures

  • Author

    Holland, Anthony S. ; Reeves, Geoffrey K. ; Harrison, H. Barry

  • Author_Institution
    R. Melbourne Inst. of Technol., Vic., Australia
  • fYear
    1997
  • Firstpage
    95
  • Lastpage
    98
  • Abstract
    The Cross Bridge Kelvin Resistor structure is a commonly used test structure for the extraction of the specific contact resistance of ohmic contacts. Analyses using this structure are generally based on a two-dimensional model which assumes zero voltage drop in the semiconductor layer (in the direction normal to the plane of the contact). This paper uses a three-dimensional analysis to show the magnitude of the errors introduced by this assumption, and illustrates the conditions under which a three-dimensional analysis should be used
  • Keywords
    contact resistance; electric resistance measurement; electrical conductivity; error correction; finite element analysis; measurement errors; ohmic contacts; semiconductor device metallisation; semiconductor device testing; semiconductor-metal boundaries; 3D analysis; Kelvin test structures; contact resistance extraction; cross bridge Kelvin resistor structure; error correction; finite semiconductor resistivity; ohmic contacts; three-dimensional analysis; two-dimensional model; Bridge circuits; Conductivity; Contact resistance; Current measurement; Error correction; Kelvin; Ohmic contacts; Resistors; Semiconductor device testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-3243-1
  • Type

    conf

  • DOI
    10.1109/ICMTS.1997.589347
  • Filename
    589347