DocumentCode
1711405
Title
Error correction for finite semiconductor resistivity in Kelvin test structures
Author
Holland, Anthony S. ; Reeves, Geoffrey K. ; Harrison, H. Barry
Author_Institution
R. Melbourne Inst. of Technol., Vic., Australia
fYear
1997
Firstpage
95
Lastpage
98
Abstract
The Cross Bridge Kelvin Resistor structure is a commonly used test structure for the extraction of the specific contact resistance of ohmic contacts. Analyses using this structure are generally based on a two-dimensional model which assumes zero voltage drop in the semiconductor layer (in the direction normal to the plane of the contact). This paper uses a three-dimensional analysis to show the magnitude of the errors introduced by this assumption, and illustrates the conditions under which a three-dimensional analysis should be used
Keywords
contact resistance; electric resistance measurement; electrical conductivity; error correction; finite element analysis; measurement errors; ohmic contacts; semiconductor device metallisation; semiconductor device testing; semiconductor-metal boundaries; 3D analysis; Kelvin test structures; contact resistance extraction; cross bridge Kelvin resistor structure; error correction; finite semiconductor resistivity; ohmic contacts; three-dimensional analysis; two-dimensional model; Bridge circuits; Conductivity; Contact resistance; Current measurement; Error correction; Kelvin; Ohmic contacts; Resistors; Semiconductor device testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 1997. ICMTS 1997. Proceedings. IEEE International Conference on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-3243-1
Type
conf
DOI
10.1109/ICMTS.1997.589347
Filename
589347
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