DocumentCode

1711414

Title

Reliability of the Pb-free solder bump on electroless ni under bump metallurgies

Author

Kim, N.S. ; Jung, S.Y. ; Oh, S.Y.

Author_Institution

Samsung Electronics Co. LTD.

fYear

2003

Firstpage

77

Lastpage

82

Keywords

Costs; Flip chip; Gold; Lead; Packaging; Pressure measurement; Printing; Temperature measurement; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216260

Filename

1216260