• DocumentCode
    1711514
  • Title

    Package to board interconnection shear strength (PBISS): effect of surface finish, PWR build-up layer and chip scale package structure

  • Author

    Canumalla, Sridhar ; Yang, Hee-Dong ; Viswanadham, Puligandla

  • Author_Institution
    Nokia Mobile Phones
  • fYear
    2003
  • Firstpage
    105
  • Lastpage
    112
  • Keywords
    Assembly; Chip scale packaging; Electronic packaging thermal management; Finite element methods; Materials testing; Mobile handsets; Production; Soldering; Surface cracks; Surface finishing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216264
  • Filename
    1216264
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1711514