DocumentCode
1711836
Title
Model for BGA and CSP reliability in automotive underhood applications
Author
Lail, P. ; Islam, Nokihul ; Suhling, Jeff ; Darveaux, Robert
Author_Institution
Auburn University
fYear
2003
Firstpage
189
Lastpage
196
Keywords
Assembly; Automotive engineering; Electronic packaging thermal management; Electronics packaging; Plastics; Soldering; Temperature; Testing; Thermal expansion; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216276
Filename
1216276
Link To Document