• DocumentCode
    171230
  • Title

    Electrospun silk doped with selenium for antibacterial skin applications

  • Author

    Chung, Shi-Uk ; Ercan, Burcu ; Webster, Thomas J. ; Tran, P.

  • Author_Institution
    Chem. Eng. Dept., Northeastern Univ., Boston, MA, USA
  • fYear
    2014
  • fDate
    25-27 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Skin is the largest organ by surface area and provides the primary defense against microbes, viruses, and other harmful environmental interactions. Silk is widely used as a cosmetic additive and has been investigated for skin regeneration because of its beneficial properties for skin application : promotion of collagen synthesis, re-epithelialization, wound healing, atopic dermatitis alleviation, and scar reduction. However, pure silk shows negligible or even negative antibacterial properties. Here, we propose for the first time, an electrospun silk scaffold doped with selenium to address this issue. Electrospun silk scaffolds have smaller interstices and higher surface areas, allowing for more efficient nutrient transfer to the skin. In addition, selenium nanoparticles have been shown to possess excellent antibacterial properties. By incorporating selenium nanoparticles into silk, we expect to retain silk´s beneficial skin healing properties while improving its antibacterial ability.
  • Keywords
    antibacterial activity; biomedical materials; diseases; electrospinning; microorganisms; nanomedicine; nanoparticles; selenium; skin; tissue engineering; Se; antibacterial skin applications; atopic dermatitis alleviation; collagen synthesis; cosmetic additive; electrospun silk scaffold doped selenium nanoparticles; microbes; nutrient transfer; reepithelialization; scar reduction; skin healing properties; skin regeneration; surface area; viruses; wound healing; Antibacterial activity; Microorganisms; Nanoparticles; Scanning electron microscopy; Skin; Wounds; Skin; antibacterial; electrospinning; selenium nanoparticles; silk;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioengineering Conference (NEBEC), 2014 40th Annual Northeast
  • Conference_Location
    Boston, MA
  • Type

    conf

  • DOI
    10.1109/NEBEC.2014.6972758
  • Filename
    6972758