DocumentCode
1712350
Title
A reliability comparison of lead free and Eutectic solder for stencil printing based flip-chip applications
Author
Yau, Esther W C ; Gong, J.F. ; Hong, Benny F W ; Chan, Philip C.H.
Author_Institution
Hong Kong University of Science and Technology
fYear
2003
Firstpage
323
Lastpage
330
Keywords
Circuit testing; Electronic waste; Environmentally friendly manufacturing techniques; Gold; Inspection; Lead; Printing; Reliability engineering; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216297
Filename
1216297
Link To Document