• DocumentCode
    1712913
  • Title

    RF circuit integration using high Q copper inductors on organic substrate and solder-bumped flip chip technology

  • Author

    Xiao, Guo-Wei ; Huo, Xiao ; Chan, Philip C H

  • Author_Institution
    Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    487
  • Lastpage
    492
  • Keywords
    Copper; Flip chip; Glass; Inductors; Integrated circuit interconnections; Integrated circuit technology; Radio frequency; Silicon; Spirals; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216323
  • Filename
    1216323
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1712913