DocumentCode

1713325

Title

Predictive failure model of flip chip on board component level assemblies

Author

Muncy, Jennifer ; Lazarakis, Theodore ; Baldwin, Daniel

Author_Institution

Georgia Institute of Technology

fYear

2003

Firstpage

578

Lastpage

582

Keywords

Assembly; Bonding; Equations; Fatigue; Flip chip; Life testing; Materials testing; Predictive models; Stress; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216339

Filename

1216339