DocumentCode

1713675

Title

Pb-free bumping by alloying electroplated metal stacks

Author

Ezawa, Hirokazu ; Miyata, Masahiro ; Seto, Masaharu ; Honma, Soichi

Author_Institution

Toshiba Corporation Semiconductor Company

fYear

2003

Firstpage

664

Lastpage

667

Keywords

Additives; Alloying; Annealing; Calorimetry; Cooling; Intermetallic; Printing; Temperature; Tin; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216353

Filename

1216353