• DocumentCode
    1713855
  • Title

    Delamination control in electronic packaging using the energy method

  • Author

    Fan, H.B. ; Tang, H.B. ; Yuen, Matthew M F ; Chan, Philip C.H.

  • Author_Institution
    Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    703
  • Lastpage
    707
  • Keywords
    Capacitive sensors; Copper; Delamination; Electromagnetic compatibility; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Testing; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216360
  • Filename
    1216360
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713855