• DocumentCode
    1713973
  • Title

    Development of a web-based course on lead free solders for electronics packaging

  • Author

    Liu, Johan ; Andersson, Cristina

  • Author_Institution
    Chalmers University of Technology
  • fYear
    2003
  • Firstpage
    739
  • Lastpage
    742
  • Keywords
    Assembly; Electronics industry; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Joining materials; Lead; Mechanical factors; Microstructure; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216366
  • Filename
    1216366
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1713973