DocumentCode

1714391

Title

Characterization of solder joint electromigration for flip chip technology

Author

Lin, Jong-Kai ; Jang, Jin-Wook ; White, Jeny

Author_Institution

Motorola, Inc.

fYear

2003

Firstpage

816

Lastpage

821

Keywords

Current density; Electric resistance; Electromigration; Electrons; Flip chip; Microstructure; Optical microscopy; Soldering; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216383

Filename

1216383