DocumentCode
171495
Title
Surface-wave leakage from substrate integrated waveguide on grounded dielectric substrate
Author
Xinru Li ; Tzuang, Ching-Kuang C. ; Hsien-Shun Wu
Author_Institution
Sch. of Electron. Inf. Eng., Tianjin Univ., Tianjin, China
fYear
2014
fDate
1-6 June 2014
Firstpage
1
Lastpage
4
Abstract
This paper presents the surface-wave leakage from a substrate integrated waveguide (SIW) on a grounded dielectric substrate, which propagates the TM0 mode at the lowest order. The hybrid generalized scattering matrix (GSM) formulation, describing the electromagnetric field inside the rectangular waveguide walls, combined with the finite-element method(FEM), accurately depicting the fields surrounding the microstrip and distributing alongside the infinitely extended grounded substrate, establishes a rigorous formulation to tackle the periodic structure. The resulting lowest order dispersion characteristics show very good agreement with those of the TE10 mode of an ideal rectangular waveguide, when the gap between the posted walls is approaching one thousandth posted wall´s diameter. Careful investigation of the electromagnetic field in the plane parallel to the ground plane shows that the leakage is 1) a TM0 surface mode, and 2) significant near and below the cutoff frequency of the rectangular waveguide section of the SIW.
Keywords
electromagnetic fields; finite element analysis; periodic structures; rectangular waveguides; substrate integrated waveguides; FEM; SIW; electromagnetic field; finite-element method; generalized scattering matrix formulation; grounded dielectric substrate; periodic structure; rectangular waveguide walls; substrate integrated waveguide; surface-wave leakage; Dielectric losses; Economic indicators; Educational institutions; Substrates; Surface waves; Surface-wave; generalized scattering matrix (GSM); leakage; substrate integrated waveguide (SIW);
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location
Tampa, FL
Type
conf
DOI
10.1109/MWSYM.2014.6848551
Filename
6848551
Link To Document