• DocumentCode
    1715454
  • Title

    Stacked 3-D MCP with plastic ball vertical interconnections

  • Author

    Miettinen, Jani ; Tanskaneu, J. ; Ristolainen, Eero O.

  • Author_Institution
    Tampere University of Technology
  • fYear
    2003
  • Firstpage
    1101
  • Lastpage
    1105
  • Keywords
    Consumer electronics; Electric variables; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Semiconductor device packaging; Stacking; Testing; Thermal management; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216428
  • Filename
    1216428
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1715454