DocumentCode
1715604
Title
A novel technology for stacking microvias on printed wiring board
Author
Liu, Fuhan ; White, George E. ; Sundaram, Venky ; Aggarwal, Ankur O. ; Hosseini, Seyed M. ; Sutter, Dean ; Tummala, Rao R.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
1134
Lastpage
1139
Keywords
Copper; Flip chip; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Partial response channels; Planarization; Space technology; Stacking; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216434
Filename
1216434
Link To Document