• DocumentCode
    1715766
  • Title

    Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

  • Author

    Caers, J.F.J.M. ; Zhao, X.J. ; Wong, E.H. ; Ong, C.K. ; Wu, Z.X. ; Ranjan, R.

  • Author_Institution
    Philips Electronics Singapore
  • fYear
    2003
  • Firstpage
    1176
  • Lastpage
    1180
  • Keywords
    Aging; Assembly; Contact resistance; Curing; Flip chip; Moisture; Nonconductive adhesives; Stress; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216441
  • Filename
    1216441
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1715766