DocumentCode
1715794
Title
RF PA module substrate via reliability
Author
Darveaux, Robert ; Yang, Jicheng ; Sheridan, Richard ; Buella, Boy ; Villareal, Paul
Author_Institution
Amkor Technology, Inc.
fYear
2003
Firstpage
1181
Lastpage
1189
Keywords
Copper; Electrical resistance measurement; Immune system; Laminates; Modular construction; Packaging; Printed circuits; Radio frequency; Temperature measurement; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216442
Filename
1216442
Link To Document