DocumentCode
1716115
Title
Electrical modeling and characterization of packaging solutions utilizing lead-free second level interconnects
Author
O´Connor, Daniel P. ; Hamel, Harvey ; Spring, Christopher ; Audet, Jean
Author_Institution
IBM Corporation
fYear
2003
Firstpage
1270
Lastpage
1276
Keywords
Ceramics; Environmentally friendly manufacturing techniques; Geometry; Hardware; Leg; Packaging; Power distribution; Power system interconnection; Springs; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216456
Filename
1216456
Link To Document