• DocumentCode
    1717155
  • Title

    Analysis of high-Q on-chip inductors realized by wafer-level packaging techniques

  • Author

    Sun, X. ; Carchon, G. ; De Raedt, W. ; Beyne, E.

  • Author_Institution
    IMEC
  • fYear
    2003
  • Firstpage
    1510
  • Lastpage
    1515
  • Keywords
    Artificial intelligence; Dielectric losses; Dielectric substrates; Electromagnetic analysis; Passivation; Radio frequency; Silicon; Spirals; Thin film inductors; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216496
  • Filename
    1216496
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1717155