DocumentCode

1718609

Title

Copper foils for high density IC packages - starting from foil/dielectric adhesion

Author

Qu, Shichun ; Goffell, R.E. ; Kieschke, Robert R.

Author_Institution

3M Eau Claire

fYear

2003

Firstpage

1815

Lastpage

1819

Keywords

Adhesives; Bonding; Copper; Dielectrics; Failure analysis; Integrated circuit packaging; Passivation; Resins; Strips; Surface resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216549

Filename

1216549