• DocumentCode
    1718770
  • Title

    Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

  • Author

    Xiao, Guo-Wei ; Gong, Jing-Feng ; Yau, Esther W C ; Chan, Philip C H ; Lee, Ricky S W ; Yuen, Matthew M F

  • Author_Institution
    Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    1850
  • Lastpage
    1855
  • Keywords
    Artificial intelligence; Copper; Fabrication; Gold; Mechanical engineering; Printing; Resists; Scanning electron microscopy; Sputtering; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216556
  • Filename
    1216556
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718770