• DocumentCode
    1718824
  • Title

    Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy

  • Author

    Zhang, Qian ; Dasgupta, Abhijit ; Haswell, Peter

  • Author_Institution
    University of Maryland
  • fYear
    2003
  • Firstpage
    1862
  • Lastpage
    1868
  • Keywords
    Consumer electronics; Creep; Electronic waste; Electronics industry; Environmentally friendly manufacturing techniques; Lead; Legislation; Plastics; System testing; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216558
  • Filename
    1216558
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718824