DocumentCode
1720502
Title
Effect of space con conduction current and breakdown of polyimide films
Author
Muramoto, Y. ; Shimizu, N. ; Fukuma, M. ; Nagao, M.
Author_Institution
Dept. of Electr. & Electron. Eng., Meijo Univ., Nagoya, Japan
Volume
1
fYear
2004
Firstpage
41
Abstract
We have been studying the breakdown characteristics of polyimide (PI) films. The purpose of this study is to clarify the effect of space charge on conduction current and breakdown of PI films. The space charge distributions and external circuit current (lex) just before the breakdown of a 125 μm thick PI films were simultaneously measured by using pulsed electro-acoustic (PEA) method in 363 K (90 °C). We tried to observe the change of space charge distribution just before the breakdown of PI films obtained by very short period interval (2 ms) measurement. lex showed a large increase, however the remarkable change of space charge distribution just before the breakdown did not show. These results showed that the breakdown of PI films is not directly caused by the distortion of the electric field, but is caused by a thermal breakdown process due to the conduction current by the temperature rise of the sample. The simultaneous measurement of transient space charge profiles and lex must contribute to the investigation of conduction and breakdown phenomena of PI films.
Keywords
electric breakdown; electrical conductivity; polymer films; pulsed electroacoustic methods; space charge; 125 micron; 2 ms; 363 K; breakdown characteristics; conduction current; external circuit current; polyimide films; pulsed electro-acoustic method; space charge distributions; space charge effect; thermal breakdown process; transient space charge profiles; Charge measurement; Conductive films; Current measurement; Distortion measurement; Electric breakdown; Polyimides; Pulse measurements; Space charge; Thick film circuits; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN
0-7803-8348-6
Type
conf
DOI
10.1109/ICSD.2004.1350284
Filename
1350284
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