The effects of surface plasma treatment on dielectric properties of polyvinylidene fluoride (PVDF) film

Author

Cygan, P.J. ; Jow, T.R.

Author_Institution

US Army Electron. Technol. & Devices Lab., Fort, Monmouth, NJ, USA

fYear

1992

Firstpage

537

Lastpage

542

Abstract

The effects of CF₄, O₂, and CF₄(96%)-O₂(4%) gas plasmas, following exposure for 4 and 16 min, on the dielectric properties of polyvinylidene fluoride (PVDF) films were investigated. No significant changes were observed with the exception of CF₄-O₂ plasma, where reductions in the breakdown strength (~15%), dielectric constant (6-9%), and electrical conductivity were found. Consistent with the higher content of β phase in a clear film than in a hazy film, higher values of breakdown strength (~9%), dielectric constant (5-15%), and dissipation factor (~20%) were measured for the clear film

Keywords

dielectric losses; dielectric properties of solids; electric breakdown of solids; electric strength; permittivity; piezoelectric materials; plasma applications; polymer films; surface treatment; 16 min; 4 min; O₂ plasma; PVDF film; breakdown strength; clear film; content of β phase; dielectric constant; dielectric properties; dissipation factor; electrical conductivity; hazy film; methane plasma; methane-O₂ plasma; piezoelectric; surface plasma treatment; Dielectrics; Electric breakdown; Piezoelectric films; Plasma applications; Plasma chemistry; Plasma materials processing; Plasma properties; Polymer films; Surface contamination; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation and Dielectric Phenomena, 1992. Annual Report. Conference on

Conference_Location

Victoria, BC

Print_ISBN

0-7803-0565-5

Type

conf

DOI

10.1109/CEIDP.1992.283160

Filename

283160