• DocumentCode
    1724865
  • Title

    Advanced overlay control in volume manufacturing

  • Author

    Wiltshire, Timothy ; Ausschnitt, Christopher ; Felix, Nelson ; Hwang, Emily ; Pike, Michael ; Gabor, Allen ; Preil, Moshe ; Couraudon, Vincent ; Schreiber, James ; Fliervoet, Timon ; Simons, Geert ; Rottenkolber, Erica

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The work reviewed will describe a particular effort in the area of overlay matching based on the BaseLiner™ package marketed by ASML. BaseLiner relies on the concept of Scanner Baseline Constants (SBCs). Traditionally, optical lithography systems are controlled by many numerical parameters known as Machine Constants (MCs). MCs are typically generated by a lithography system during in situ or other system based tests that generate and optimize the MCs for a very specific test condition set. The concept of SBCs introduces a “middle layer” of offsets that forces tools to be closely matched to one another under general lithography conditions, not just the specific test conditions used for MC generation. The methodology is designed to handle specific product layouts.
  • Keywords
    manufacturing systems; photolithography; process control; semiconductor device manufacture; ASML; BaseLiner package; advanced overlay control; machine constant; middle layer; optical lithography system; scanner baseline constant; specific product layouts; specific test condition set; volume manufacturing; Calibration; Lithography; Metrology; Monitoring; Process control; Semiconductor device modeling; advanced process control; baseline; lithography; lithography controls; overlay;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2011 22nd Annual IEEE/SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-61284-408-4
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2011.5898173
  • Filename
    5898173