DocumentCode
1726399
Title
Investigation of short circuit caused by reduction of PbO sealing glass used for VLSI package
Author
Sato, Keiichi ; Okinaga, Takayuki ; Kohara, Tetsuji ; Ota, Tadaaki ; Otsuka, Kanji ; Honda, Atsushi ; Mizuno, Chouichirou
Author_Institution
Hitachi VLSI Eng. Corp., Tokyo, Japan
fYear
1993
Firstpage
103
Lastpage
107
Abstract
During the development of a high power dissipating package for VLSI, a serious short circuit was discovered in the test manufacturing sample. The package was constructed with a combination of conventional packaging materials such as ceramic base, PbO sealing glass, molybdenum heat-sink, and aluminum evaporated lead frame. It was found that PbO in the sealing glass was reduced by hydrogen out-gassed from the molybdenum heat-sink of the package.<>
Keywords
VLSI; circuit reliability; packaging; reduction (chemical); seals (stoppers); short-circuit currents; H outgassing; Mo heat sink; PbO-SiO/sub 2/ sealing glass; QFP; VLSI package; high power dissipating package; reduction; short circuit; Aluminum; Ceramics; Circuit testing; Cogeneration; Glass; Lead; Manufacturing; Packaging; Sealing materials; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location
Atlanta, GA, USA
Print_ISBN
0-7803-0782-8
Type
conf
DOI
10.1109/RELPHY.1993.283294
Filename
283294
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