DocumentCode
1727537
Title
Surge Current Ruggedness of Silicon Carbide Schottky- and Merged-PiN-Schottky Diodes
Author
Heinze, Birk ; Lutz, Josef ; Rupp, Roland ; Holz, Matthias ; Neumeister, Matthias
Author_Institution
Dept. of Power Electron., Chemnitz Univ. of Technol., Chemnitz
fYear
2008
Firstpage
245
Lastpage
248
Abstract
In the paper the surge current capability of different power diodes made of silicon carbide (SiC) providing Schottky- and merged-pin-Schottky (MPS) structures are investigated. The diodes were impinged with surge current pulses of different shape and time. Depending on the diodes and there structures, they provide a different responsiveness. In some cases apart from the diode design it´s time constant and the case influences the destruction limit of the surge current capability. There exist different destruction mechanisms. The destruction mechanism of MPS diodes of one diode type was the temperature limitation of the metallization melting point. While the surge current pulse the SiC diodes reaches astonishingly high temperatures at the epitaxy layer and the metallization. The diodes of a second diode type show destructive hot spots.
Keywords
Schottky diodes; p-i-n diodes; silicon; silicon compounds; SiC; merged-pin-Schottky diode; metallization melting point; silicon carbide; surge current; Chemical technology; Paper technology; Power electronics; Pulse measurements; Pulse shaping methods; Schottky diodes; Semiconductor diodes; Silicon carbide; Surges; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
978-1-4244-1532-8
Electronic_ISBN
978-1-4244-1533-5
Type
conf
DOI
10.1109/ISPSD.2008.4538944
Filename
4538944
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