High speed and low cost FOB (Film-on-Board) direct bonding using laser soldering technology

Author

Hong, Soon-Min ; Choi, Won ; Koo, Ja-Myeng ; Choi, Won ; Moon, Young-Jun

Author_Institution

Global Manuf. Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea

fYear

2011

Firstpage

537

Lastpage

540

Abstract

The laser soldering was estimated for a high productivity and cost-effective FOB (Film-on-Board) bonding method. The local solder joint is rapidly heated up in laser soldering. The process can be optimized by laser power, beam scanning speed, scanning path, solder pre-coating condition, flux, and soldering fixture. It was possible to get enough peel strength, process yields, and reliability on the optimized laser soldering process condition. The two major failure modes in laser soldering were cold solder joint and burning of film.

Keywords

bonding processes; integrated circuit reliability; laser materials processing; printed circuits; soldering equipment; FOB direct bonding method; beam scanning speed; failure mode; film burning; film-on-board direct bonding method; laser power; laser soldering technology; scanning path; solder joint; solder precoating condition; soldering fixture; Bonding; Films; Laser beams; Power lasers; Reliability; Semiconductor lasers; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898563

Filename

5898563