A multi-layer plastic/glass technology for microfluidic systems with integrated functionality

Author

Han, A. ; Graff, M. ; Wang, O. ; Mohanty, S.K. ; Han, K.-H. ; Frazier, A.B.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

2003

Firstpage

1315

Abstract

A multi-layer plastic/glass technology has been developed for microfluidic systems with integrated functionality. Hot embossing and heat staking of plastics, microstenciling of electrodes, and stereolithography (SLA) was combined with conventional MEMS fabrication techniques to realize the system. The approach enables the use of multiple plastic/glass materials in a single system, provides a solution for the integration of electrical functionality throughout the system, provides a mechanism for the inclusion of microvalves, and provides an interconnect technology for interfacing fluids and electrical components between the macro and the micro worlds.

Keywords

glass; interconnections; microfluidics; microvalves; multilayers; plastics; stereolithography; MEMS fabrication; electrical components; electrical functionality; electrodes microstenciling; heat staking; hot embossing; integrated functionality; interconnect technology; interfacing fluids; microfluidic systems; microvalves inclusion; multilayer glass materials; multilayer plastic materials; stereolithography; Bonding; Electrodes; Embossing; Fluidic microsystems; Glass; Microchannel; Microfluidics; Microvalves; Plastics; Polyethylene;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1217015

Filename

1217015