Electromigration studies of lead-free solder balls used for wafer-level packaging

Author

Hau-Riege, Christine ; Zang, Ricky ; Yau, You-Wen ; Yadav, Praveen ; Keser, Beth ; Lin, Jong-Kai

Author_Institution

Qualcomm, Santa Clara, CA, USA

fYear

2011

Firstpage

717

Lastpage

721

Abstract

Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size.

Keywords

ball grid arrays; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; metallurgy; solders; surface mount technology; wafer level packaging; BGA interconnects; Joule heating; electromigration reliability; failure mode; lead-free flip-chip bumps; lead-free solder balls; lifetime distribution; surface mount; under bump metallurgy; wafer-level packaging; Copper; Current density; Electromigration; Heating; Integrated circuit interconnections; Nickel; Reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898592

Filename

5898592