• DocumentCode
    1728619
  • Title

    PA7300LC integrates cache for cost/performance

  • Author

    Hollenbeck, D. ; Undy, S.R. ; Johnson, L. ; Weiss, D. ; Tobin, P. ; Carlson, R.

  • Author_Institution
    Eng. Syst. Lab., Hewlett-Packard Co., Fort Collins, CO, USA
  • fYear
    1996
  • Firstpage
    167
  • Lastpage
    174
  • Abstract
    HP continues its development of low cost, high performance processors with an evolution of the PA7100LC which includes 128 kB of on-chip primary cache. It implements the full PA-RISC1.1 functionality including the little-endian, uncacheable memory, and multimedia extensions of the PA7100LC. The PA7300LC connects directly to an optional second level cache of 256 kB to 64 MB using plug-in cards. It also adds the ability to accelerate I/O stores to certain memory locations for greatly improved graphics performance. The cache system consists of on-chip, 2-way, separate instruction and data caches of 64 kB total each, plus the off-chip second level cache. Memory consists of 8 MB to 3.75 GB of standard DRAMs or SIMMs connecting directly to the processor chip, using either a 72 bit or 144 bit data path. The chip is fabricated in 0.5 micron, 4-level metal CMOS and is designed to run at frequencies up to 160 MHz. The PA7300LC exceeds performance levels of previous generation high-end workstations while lowering overall system cost and power consumption.
  • Keywords
    CMOS integrated circuits; microprocessor chips; reduced instruction set computing; CMOS IC; PA-RISC1.1 functionality; PA7100LC; PA7300LC; cache; cost/performance; high performance processors; multimedia extensions; on-chip primary cache; power consumption; system cost; Acceleration; Circuit testing; Cost function; Energy consumption; Frequency; Joining processes; Power generation; System-on-a-chip; Systems engineering and theory; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compcon '96. 'Technologies for the Information Superhighway' Digest of Papers
  • Conference_Location
    Santa Clara, CA, USA
  • ISSN
    1063-6390
  • Print_ISBN
    0-8186-7414-8
  • Type

    conf

  • DOI
    10.1109/CMPCON.1996.501764
  • Filename
    501764