DocumentCode
1728725
Title
Thermally actuated, bi-stable, snapping silicon membranes
Author
Arya, R. ; Rashid, M.M. ; Howard, D. ; Collins, S.D. ; Smith, R.L.
Author_Institution
Microinstrum. & Syst. Lab., California Univ., Davis, CA, USA
Volume
2
fYear
2003
Firstpage
1411
Abstract
Thermally actuated, bistable, snapping silicon membranes have been fabricated on a silicon wafer and tested. Nonlinear finite element analysis has been used to model the snapping behavior of the membranes and to refine their design. A unique feature of these membranes is that after snapping down, they remain in the downward buckled state as the temperature decreases back to its starting point. The critical snapping temperature range is 50/spl deg/C-60/spl deg/C for 2 mm square, 6 /spl mu/m thick membranes with 1 /spl mu/m SiO/sub 2/ on top and 3 /spl mu/m aluminum deposited on the backside. The snapping temperature can be varied by changing the dimensions and materials used in the membrane fabrication.
Keywords
elemental semiconductors; finite element analysis; membranes; microactuators; silicon; 1 micron; 3 micron; 6 micron; Al-SiO/sub 2/-Si; bistable snapping silicon membranes; critical snapping temperature; downward buckled state; nonlinear finite element analysis; silicon wafer; thermally actuated snapping silicon membranes; Actuators; Aluminum; Biomembranes; Fabrication; Finite element methods; Microrelays; Microvalves; Plasma temperature; Silicon; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1217039
Filename
1217039
Link To Document