• DocumentCode
    1728725
  • Title

    Thermally actuated, bi-stable, snapping silicon membranes

  • Author

    Arya, R. ; Rashid, M.M. ; Howard, D. ; Collins, S.D. ; Smith, R.L.

  • Author_Institution
    Microinstrum. & Syst. Lab., California Univ., Davis, CA, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1411
  • Abstract
    Thermally actuated, bistable, snapping silicon membranes have been fabricated on a silicon wafer and tested. Nonlinear finite element analysis has been used to model the snapping behavior of the membranes and to refine their design. A unique feature of these membranes is that after snapping down, they remain in the downward buckled state as the temperature decreases back to its starting point. The critical snapping temperature range is 50/spl deg/C-60/spl deg/C for 2 mm square, 6 /spl mu/m thick membranes with 1 /spl mu/m SiO/sub 2/ on top and 3 /spl mu/m aluminum deposited on the backside. The snapping temperature can be varied by changing the dimensions and materials used in the membrane fabrication.
  • Keywords
    elemental semiconductors; finite element analysis; membranes; microactuators; silicon; 1 micron; 3 micron; 6 micron; Al-SiO/sub 2/-Si; bistable snapping silicon membranes; critical snapping temperature; downward buckled state; nonlinear finite element analysis; silicon wafer; thermally actuated snapping silicon membranes; Actuators; Aluminum; Biomembranes; Fabrication; Finite element methods; Microrelays; Microvalves; Plasma temperature; Silicon; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1217039
  • Filename
    1217039