DocumentCode
1729624
Title
Modeling of failure mechanisms for optimized MEMS CAD: design, fabrication and characterization of in situ test benches
Author
Millet, O. ; Agache, V. ; Legrand, B. ; Collard, D. ; Buchaillot, L.
Author_Institution
Inst. d´Electron. de Micro-electron. et de Nanotechnol., CNRS, Villeneuve d´Ascq, France
Volume
2
fYear
2003
Firstpage
1578
Abstract
This work considers the reliability of surface microfabricated structures and particularly the dynamic response of structural layers during operations, in order to develop a statistical modelling of failure mechanisms for micro-actuator. In situ test benches have been designed and fabricated allowing to applied elementary solicitations (traction, bending and torsion) to representative samples. Gold, in situ doped polysilicon and polysilicon doped by diffusion are used as structural layers. These devices are useful to study the fatigue phenomenon. Characterization and fatigue tests have been performed in a vacuum chamber under different environmental and stimuli conditions. Moreover, a theoretical analysis using Finite Elements Method has been achieved.
Keywords
CAD; bending; diffusion; elemental semiconductors; failure analysis; fatigue; finite element analysis; gold; mechanical testing; microactuators; reliability; silicon; torsion; traction; MEMS CAD; Si:Au; bending; diffusion; elementary solicitations; failure mechanisms; fatigue tests; finite elements method; gold; microactuator; polysilicon; reliability; surface microfabricated structures; torsion; traction; Design automation; Design optimization; Fabrication; Failure analysis; Fatigue; Gold; Microactuators; Micromechanical devices; Performance evaluation; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1217081
Filename
1217081
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