Delamination prediction in lead frame packages using adhesion measurements and interfacial fracture modeling

A combined adhesion characterization and fracture mechanics based modeling methodology has been developed to predict delamination in lead frame packages. This methodology allows experimental data from a simple adhesion test such as button shear test to be used along with the finite element model to ultimately predict whether a particular interface will fail in reliability testing. The methodology was validated using existing package reliability data across several package types, materials and package interfaces. In each case, the delamination prediction was compared to the actual occurrence of delamination post reliability testing. The validation showed that delamination could be predicted with 80-90% accuracy, depending on the interface and the temperature condition considered.