3D stack packaging solution for BAW devices: 3D packaging demonstrator and RF performance

Author

Sun, X. ; Posada, G. ; Majeed, B. ; Zhang, W. ; De Raedt, W. ; Diekmann, C. ; Eggs, C. ; Schmidhammer, E.

Author_Institution

Imec, Leuven, Belgium

fYear

2011

Firstpage

127

Lastpage

130

Abstract

This paper presents a 3D integration concept as a solution to package FBAR or BAW devices providing at the same time additional RF functionality. The feasibility of this 3D packaging solution has been proven by the successful realization of a 3D packaging demonstration vehicle including FBAR device, solder ring, bumps, through substrate via, low loss interconnects and extra integrated RF functionality. A good RF performance has been obtained. This concept could also be used for the packaging of MEMS, since the requirements are similar.

Keywords

bulk acoustic wave devices; electronics packaging; integrated circuit interconnections; solders; 3D integration; 3D packaging demonstrator; 3D stack packaging; BAW devices; FBAR devices; RF performance; bumps; low loss interconnects; solder ring; through substrate via; Film bulk acoustic resonators; Impedance matching; Inductors; Loss measurement; Packaging; Radio frequency; Three dimensional displays; 3D stack; Balun; FBAR; IMEC thin film technology; Inductor; Packaging; RF interconnection;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European

Conference_Location

Helsinki

ISSN

1930-8876

Print_ISBN

978-1-4577-0707-0

Electronic_ISBN

1930-8876

Type

conf

DOI

10.1109/ESSDERC.2011.6044218

Filename

6044218