Metal to glass anodic bonding for microsystems packaging

Author

Briand, D. ; Weber, P. ; de Rooij, N.F.

Author_Institution

Inst. of Microtechnol., Neuchatel Univ., Switzerland

Volume

2

fYear

2003

Firstpage

1824

Abstract

In this communication, we report on metal to glass anodic bonding for Microsystems packaging. Bonded Pyrex-Foturan/Metal double stack and Silicon/Pyrex/Metal triple stack were investigated for applications in the sensor encapsulation field. Anodic bonding of metals, sheets of Invar, Kovar, Alloy 42 and Titanium, and thin films of Titanium, to Ion-containing glasses with two different thermal expansion coefficients, Pyrex and Foturan, was evaluated in terms of samples preparation, bonding parameters, and bonding characteristics. Selected metals anodically bonded to glass exhibited levels of residual stress, strength and tightness that make this technique suitable for packaging Microsystems, silicon piezoresistive sensors and micro-fluidic systems, among others.

Keywords

bonding processes; cobalt alloys; elemental semiconductors; encapsulation; glass; internal stresses; iron alloys; metallic thin films; microfluidics; nickel alloys; packaging; sensors; silicon; thermal expansion; titanium; FeNi; FeNiCo; Invar; Kovar; alloy 42; bonded pyrex-Foturan/metal double stack; bonding parameters; metal-glass anodic bonding; microfluidic systems; microsystems packaging; residual stress; sensor encapsulation field; silicon piezoresistive sensors; silicon/pyrex/metal triple stack; thermal expansion coefficients; thin films; Bonding; Encapsulation; Glass; Packaging; Residual stresses; Sensor phenomena and characterization; Silicon; Thermal expansion; Titanium alloys; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1217142

Filename

1217142