• DocumentCode
    1731226
  • Title

    Influence of cable processing on the insulation impurity content

  • Author

    Pelissou, Serge ; St.-Antoine, S.

  • Author_Institution
    Hydro-Quebec, Montreal, Que., Canada
  • Volume
    1
  • fYear
    1998
  • Firstpage
    97
  • Abstract
    One of the principal cause of the initiation and growth of water trees in extruded cable insulation is impurities. This paper presents results on a comparison between impurity content of various insulation and semiconducting shield materials before and after extruded cable processing. Three types of insulation resin, including one conventional crosslinked polyethylene (XLPE) and two water tree retardant XLPE (WTRXLPE), and also two types of conductor shield and insulation shield resins were considered. The cables are of the 28 kV class with aluminum conductor, and one of them with a strandfill material. The measurements were performed by neutron activation on many samples taken from several batch resins and along the cables, and for several elements. The results indicate that the overall resin impurity content is lower than the respective cable component ones, which reveals that the manufacturing process has an influence on the insulation impurity content
  • Keywords
    XLPE insulation; extrusion; impurity distribution; neutron activation analysis; power cable insulation; power cable testing; trees (electrical); 28 kV; Al conductor; cable processing; conductor shield; conventional XLPE; extruded cable insulation; insulation impurity content; insulation resin; insulation shield resins; manufacturing process; neutron activation; semiconducting shield materials; strandfill material; water tree retardant XLPE; water trees; Cable insulation; Cable shielding; Cables; Conducting materials; Polyethylene; Resins; Semiconductivity; Semiconductor impurities; Semiconductor materials; Trees - insulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-4927-X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1998.704657
  • Filename
    704657