• DocumentCode
    1731682
  • Title

    A framework for analyzing energy efficient injection-molding die design

  • Author

    Mattis, James ; Sheng, Paul ; DiScipio, William ; Leong, Ken

  • Author_Institution
    Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
  • fYear
    1996
  • Firstpage
    207
  • Lastpage
    212
  • Abstract
    A significant part of the development of electronics products is the design of injection-molded thermoplastic parts ranging from chassis panels and enclosures to connectors. While much effort has been spent on analyzing the end-of-life issues associated with thermoplastic parts, such as disassembly, separation, and recycling, a primary driver for design-for-environment of plastic parts is the energy expended in the forming process. Traditional part design and process parameter selection, which is performed with the goal of minimizing process cycle time, often overlooks environmental issues such as energy efficiency. This paper analyzes the influence of component and mold design decisions as well as process parameters selection on the process energy efficiency through a framework that integrates a 3D solid modeling environment, numerical analysis of the filling and post-filling behavior, and an energy-based process model. The process model that is presented describes the modes of energy utilization in injection molding processes as they relate to design-for-environment concerns. Case studies are performed on a center-gated plastic disk, and a small plastic enclosure to illustrate the use of this framework
  • Keywords
    energy conservation; environmental factors; numerical analysis; plastics industry; product development; 3D solid modeling environment; design-for-environment; electronics products development; energy efficiency; energy utilization; energy-based process model; filling; injection-molding die design; mold design decisions; numerical analysis; parameter selection; post-filling; process cycle time; thermoplastic parts; Connectors; Driver circuits; Energy efficiency; Filling; Numerical analysis; Plastics; Process design; Product design; Recycling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1996. ISEE-1996., Proceedings of the 1996 IEEE International Symposium on
  • Conference_Location
    Dallas, TX
  • Print_ISBN
    0-7803-2950-3
  • Type

    conf

  • DOI
    10.1109/ISEE.1996.501879
  • Filename
    501879