Thermal behaviours of silicone-based optical interconnects with mirror optical coupling

Author

Cai, D.K. ; Neyer, A.

Author_Institution

Fak. fur Elektrotechnik und Informationstechnik, Arbeitsgebiet Mikrostrukturtechnik (AG MST), Tech. Univ. Dortmund, Dortmund, Germany

fYear

2011

Firstpage

1679

Lastpage

1683

Abstract

The thermal stability of mirror coupling in polymer optical interconnects has been investigated by means of of the FVM (finite volume method) based software FLOTHERM. According to the approach, thermal simulations were performed to study polymer waveguides layers within polymer optical interconnects with mirror coupling solution. In the case of mirror-coupling, temperature distributions and gradients in the key waveguide layer were analyzed. With this simulated temperature distribution and the experimentally evaluated refractive indices and thermo-optic coefficients (TOC) of core and cladding silicones, the influence on the maximum data transmission capability in silicone based waveguides is discussed as well as the impact on waveguide insertion loss figures at 850 nm.

Keywords

finite volume methods; mirrors; optical couplers; optical interconnections; optical polymers; optical waveguides; refractive index; silicones; thermal stability; thermo-optical effects; FLOTHERM; finite volume method; mirror coupling solution; mirror optical coupling; polymer optical interconnects; polymer waveguides layers; refractive index; silicone based optical interconnects; thermal behaviour; thermal simulations; thermal stability; thermo-optic coefficients; waveguide insertion loss; wavelength 850 nm; Optical device fabrication; Optical interconnections; Optical refraction; Optical variables control; Optical waveguides; Temperature distribution; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898737

Filename

5898737