• DocumentCode
    1732308
  • Title

    Experimental survey of semiconductor power device operation at low temperature

  • Author

    Hong, Ki Bum ; Jaeger, Richard C.

  • Author_Institution
    Dept. of Electr. Eng., Auburn Univ., AL, USA
  • fYear
    1989
  • Firstpage
    99
  • Lastpage
    103
  • Abstract
    The authors report the results of an initial study of the behavior of various semiconductor power devices down to 77 K, including MOS, bipolar, and merged MOS/bipolar structures. It is found that all the devices tested continue to exhibit usable static characteristics at temperatures down to 77 K. As one might expect, the characteristics of power MOSFETs improve as temperature is reduced, and MOSFETs can be useful over the full temperature range 300 K-77 K. Even devices with bipolar structures, such as the bipolar junction transistor, silicon-controlled rectifier, and IGBT, continue to operate down to liquid-nitrogen temperature
  • Keywords
    bipolar transistors; insulated gate field effect transistors; low-temperature techniques; power transistors; semiconductor device testing; thyristors; 77 to 300 K; IGBT; bipolar junction transistor; low temperature; merged MOS/bipolar structures; power MOSFETs; semiconductor power device operation; silicon-controlled rectifier; static characteristics; Bipolar transistors; Circuits; High temperature superconductors; MOSFETs; Microelectronics; Schottky diodes; Semiconductor diodes; Temperature distribution; Thyristors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Temperature Semiconductor Electronics, 1989., Proceedings of the Workshop on
  • Conference_Location
    Burlington, VT
  • Type

    conf

  • DOI
    10.1109/LTSE.1989.50190
  • Filename
    50190