Low-residue soldering of military electronics

Author

Koon, Jeff

Author_Institution

Texas Instrum Inc., USA

fYear

1996

Firstpage

318

Lastpage

322

Abstract

In support of the Montreal Protocol and a directive from former President George Bush to phase out production of ozone-depleting chemicals (ODCs), Texas Instruments Incorporated (TI) mandated the elimination of ODCs from TI operations by the end of 1994. ODCs were used extensively in the TI Defense Systems and Electronics business for cleaning circuit card assemblies (CCAs) after soldering. In 1991, TI began evaluating low-residue flux (LRF)/controlled atmosphere soldering (CAS) as an alternative to cleaning rosin flux residues from CCAs with ODCs. This paper details TI´s evaluation and successful implementation of the LRF/CAS process in the production of military electronics. This process is approved for use on 60 military programs at TI ESD in McKinney, Texas, USA

Keywords

electronics industry; environmental factors; military equipment; printed circuit manufacture; surface cleaning; wave soldering; Montreal Protocol; Texas Instruments; USA; circuit card assemblies cleaning; controlled atmosphere soldering; low-residue soldering; military electronics; ozone-depleting chemicals; rosin flux residues; Assembly systems; Atmosphere; Chemical products; Circuits; Cleaning; Content addressable storage; Instruments; Production; Protocols; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and the Environment, 1996. ISEE-1996., Proceedings of the 1996 IEEE International Symposium on

Conference_Location

Dallas, TX

Print_ISBN

0-7803-2950-3

Type

conf

DOI

10.1109/ISEE.1996.501900

Filename

501900