• DocumentCode
    1733510
  • Title

    Partial discharge inception characteristics in artificial air-filled voids at room and liquid nitrogen temperatures

  • Author

    Tsuru, S. ; Nakamura, M. ; Mine, T. ; Suehiro, J. ; Hara, M.

  • Author_Institution
    Dept. of Electr. & Electron. Syst. Eng., Kyushu Univ., Fukuoka, Japan
  • Volume
    1
  • fYear
    1998
  • Firstpage
    153
  • Abstract
    A part of gas substances in a void in solid insulators becomes liquid or solid at cryogenic temperature and the reduction in gas pressure in it may cause a decrease in partial discharge (PD) inception voltage. In this study, PD inception voltage and PD characteristics around the PD inception in artificial air-filled voids are investigated experimentally at room and liquid nitrogen temperatures. The results show that PD inception voltage decreases with decrease in ambient temperature due to the liquefaction of oxygen. PD characteristics just after the PD inception at liquid nitrogen temperature are affected by arrangement of test sample. Based on the simultaneous measurement of the current pulses and light images, PD characteristic dependence on the sample arrangement is discussed, taking account of the phase change of oxygen in the void
  • Keywords
    cryogenics; insulating materials; liquefaction; partial discharges; voids (solid); 298 K; 77 K; PD inception characteristics; Paschen curves; ambient temperature effect; artificial air-filled voids; current pulses; light images; liquefaction of oxygen; liquid nitrogen temperature; room temperature; sample arrangement dependence; simultaneous measurement; solid insulators; Cryogenics; Dielectric liquids; Gas insulation; Nitrogen; Partial discharges; Pulse measurements; Solids; Temperature; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-4927-X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1998.704685
  • Filename
    704685